深圳市福汇科技有限公司

陶瓷天线

天线-顶针-5G天线-胶棒天线  ꄲ  陶瓷天线

a7d02f3c128cec9f4709a93e48aacd9文件编号： FH-TC-007

 

 

 

 

 

 

 

 

陶瓷天线简介

 

 

 

 

 

 

 

 

 

拟制：                      审核：                            日期：

 

      陶瓷天线简介瓷天线简介

陶瓷天线简介

 

 

陶瓷天线

陶瓷天线是一种用于通信、导航、雷达等领域的天线器件。它具有体积小、重量轻、频宽宽、耐温性好、抗干扰能力强等特点，被广泛应用于移动通信、卫星导航、飞行器等领域。下文以一款蓝牙天线为例，介绍其制造工艺流程。

1.陶瓷材料制备

      陶瓷材料的选择直接影响天线的性能指标。一般选用介电常数大，损耗小的瓷质材料。陶瓷材料的制备方式有多种，常见的有注浆成型法和压延成型法。本案例采用注浆成型法，即将陶瓷粉末与有机溶剂按一定比例混合后，注入模具中进行成型，再通过干燥、清洗等工艺步骤得到成品。

2.金属化处理

      陶瓷材料具有较好的介电性能，但其导电性能不足。因此，需要通过金属化处理提高导电性能。金属化处理一般采用化学镀银、真空蒸镀、电化学镀等方式。本案例采用化学镀银法。具体工艺流程如下：

（1）       清洗：将已经成型的陶瓷天线进行水洗、超声波清洗等工艺处理，出去表面杂质和油脂。     

（2）酸洗：将清洗好的陶瓷天线放入硝酸中进行酸洗，去除陶瓷表面的氧化层，并为后续步骤提供光洁表面

（3）化学镀银：将经酸洗处理的陶瓷天线浸入含有AgN03的银水中，经过还原反应后在陶瓷表面渡上一层粒子从而实现金属化处理。

3.组装配件

将金属化处理好的陶瓷天线，同其他金属组件（如中性点、馈线）进行组装。组装方式有焊接、粘接、压装等多种方式，本案例采用压装方式。将组件通过机械压力压合，形成一个整体，达到确保天线性能稳定的目的

4.组装完成后，需要对天线进行调试测试。测试内容主要包括天线增益、轴比、驻波比等多项指标。

下面为一例陶瓷天线各项测试数据示例:

img23.2X1.6X0.5(mm)WiFi/Bluetooth Ceramic Chip Antenna

Engineering Specification

 

1 .Product Number

FH

3216

2

Q2

;3

3

 

4

2P52

 

5:

 

 

 

 

 

 

 

 

 

 

 

 

(1)Product Type

Chip Antenna

(2)Size Code

3.6x1.2x0.5mm

(3)Type Code

H2

(4)Packing

Plastic Packaging

(5)Frequency

2.45GHz

 

img3

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUI   TECHNOLOYCO.,LTD.

Prepared by:JIEXI Designed by:Jason Checked by:Jason Approved by: MR.FANG

TITLE :3.2×1.6x0.5(mm)WiFi/Bluetooth Ceramic Chip

Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV.

B

PAGE    1       OF       13

 

 

2.Features

*Stable and reliable in performances

*Low temperature coefficient of frequency

*Low profile,compact size

*RoHS        compliance

*SMT processes compatible

3.Applications

*Bluetooth earphone systems

*Hand-held devices when WiFi /Bluetooth functions are needed,e.g.,Smart phone. *IEEE802.11 b/g/n

*ZigBee

*Wireless PCMCIA cards    or USB   dongle

 

 

 

 

4.Description

Yingfeng chip antenna series are specially designed for WiFi/Bluetooth applications.Based on yingfeng proprietary design  and  processes,this  chip  antenna  has  excellent  stability  and sensitivity to consistently provide high signal reception efficiency.

5.Electrical Specifications (80x40 mm²ground plane)

 

 

Table
5-1.Electrical

 

Characteristics

Specifications

Unit

Outline Dimensions

3.2x1.6x0.5

mm

Working Frequency

2400~2500

MHZ

VSWR

2 Max

 

Impedance

50

Ω

Polarization

Linear Polarization

 

 

Gain

Peak

3.5(typical)

dBi

Efficiency

78 (typical)

%

 

img4

 

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUI TECHNOLOYCO.,LTD.

Prepared by:JIEXI Designed by:Jason Checked by:Jason Approved by: MR.FANG

TITLE   :3.2×1.6x0.5(mm)WiFi/Bluetooth Ceramic Chip

Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV.

B

PAGE   2 OF 13

 

 

 

5-2.Return  Loss  &VSWR

 

Return Loss (Si)                                                                 VSWR(S11)

img5

img6

 

 

6 .Antenna Dimensions &Test Board (unit:mm)

a.Antenna Dimensions

 

 

Dimension and Terminal Confiquration

 

img7

 

Dimension (mm)

L

3.15+-0.15

W

T

1.55+-0.15

0.50+-0.10

A

0.35+-0.10

 

 

No.

1

Terminal Name

Feeding point

2

GND

 

img8

 

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUI TECHNOLOYCO.,LTD.

Prepared by:JIEXI Designed by:Jason Checked by:Jason Approved by: MR.FANG

TITLE   :3.2×1.6x0.5(mm)WiFi/Bluetooth Ceramic Chip

Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV.

B

PAGE   3 OF 13

 

 

 

 

b.Test Board with Antenna

img9

80

导
Unit:mm

 

 

 

7.Radiation Pattern (80x40 mm²ground plane

7-1.3D   Gain   Pattern   @2442   MHz

 

 

img10dh-ag°

Roll-0.0

 

 

 

 

 

X

img11

 

 

深 圳 市 福 汇 科 技 有 限 公 司

SHEN ZHEN FUHUITECHNOLOYCO.,LTD.

Prepared by:JIEXI       Designed by:Jason        Checked by:Jason        Approved by:MR.FANG

TITLE:3.2x1.6x 0.5(mm)WiFi/Bluetooth Ceramic Chip Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV

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PAGE  4     OF   13

 

 

 

 

img12Azimuth  -180.0

Elevatiom-3.1

Roll   -180.0

img13

 

 

 

dh

img14Ran~  0                          Z

 

 

 

 

Y

 

 

 

 

img15

 

7-2.3D Efficiency   Table

 

Frequency(MHz)

2400

2410

2420

2430

2442

2450

2460

2470

2480

2490

2500

Efficiency (dB)

-1.4

-1.0

-0.9

-0.7

-0.7

-0.8

-0.9

-1.1

-1.2

-1.3

-1.4

Efficiency(%

72.8

73.7

74.3

74.4

75.5

75.0

74.0

73.6

73.1

72.6

71.5

Gain (dBi)

2.1

2.2

2.3

2.4

2.5

2.5

2.4

1.8

1.7

1.6

1.4

 

img16

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUI TECHNOLOYCO.,LTD.

Prepared by:JIEXI Designed by:Jason Checked by:Jason Approved by: MR.FANG

TITLE :3.2×1.6x0.5(mm)WiFi/Bluetooth Ceramic Chip

Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV.

B

PAGE    5       OF       13

 

 

 

 

 

 

 

7-3.3D Efficiency vs.Frequency

 

img17Efficiency vs.Frequency

100

 

Efficiency(%)

90

 

80

 

70

 

60

 

50

2400   2410

 

 

 

 

 

 

 

 

 

 

 

2420   2430

 

 

 

 

 

 

 

 

 

 

 

2442   2450   2460

Frequency(MHz)

 

 

 

 

 

 

 

 

 

 

 

2470 2480   2490   2500

 

8.Layout Guide

a.Solder Land Pattern:

Land pattern for soldering (gray marking areas)is as shown below.Depending on Customer's requirement,matching circuit as shown below is also recommended

 

 

img18-90.00

 

SNDVIa

 

 

名  [

40.00

 

 

 

 

 

Top view

img19

 

 

深 圳 市 福 汇 科 技 有 限 公 司

SHEN ZHEN FUHUITECHNOLOYCO.,LTD.

Prepared by:JIEXI       Designed by:Jason        Checked by:Jason        Approved by:MR.FANG

TITLE:3.2x1.6x 0.5(mm)WiFi/Bluetooth Ceramic Chip Antenna (YF3216H2)Engineering Specification

DOCUMENT NO

FH3216Q23P52

REV

B

PAGE  6     OF   13

 

 

 

 

 

 

 

 

Unit:mm

img200.60

 

2.60 1.60

 

 

5

 

 

 

 

Detail view

img21

Bottom view

img22

 

 

深 圳 市 福 汇 科 技 有 限 公 司

SHEN ZHEN FUHUITECHNOLOYCO.,LTD.

Prepared by:JIEXI       Designed by:Jason        Checked by:Jason        Approved by:MR.FANG

TITLE:3.2x1.6x 0.5(mm)WiFi/Bluetooth Ceramic Chip Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV

B

PAGE  7     OF   13

 

 

 

 

 

 

 

 

9.Frequency tuning

img23a.Chip antenna tuning scenario:

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

b.Matching circuit:(Center frequency is about 2442 MHz @80x40 mm²ground plane)

 

 

 

 

 

System Matching Circuit Component

Location

Description

Vendor

Toleranc e

 

1.2 pF*

Murata (0402)

±0.1 pF

2

10PF*

Murata(0402)

±0.5 PF

3

N/A*

 

 

Fine tuning

element

4

1.5 pF*

Murata (0402)

±0.1 pF

 

*Typical reference values which may need to be changed when circuit boards or part vendors are different.

img24

 

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUI TECHNOLOYCO.,LTD.

Prepared by:JIEXI Designed by:Jason Checked by:Jason Approved by: MR.FANG

 

TITLE:

3.2×1.6x0.5(mm)WiFi/Bluetooth Ceramic Chip Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV.

B

 

PAGE   8

OF

13

 

 

 

-40.00

-50.00

 

 

 

 

 

c.Fine tuning

 

 

Center 2.45

 

 

 

 

 

 

element vs.Center frequency

 

 

 

 

 

img25230MHz-

 

 

02

 

 

GH

 

 

 

S0pE

39pF

 

 

 

 

15pF

22pF

 

 

 

6pF

8pF

7pF    5pF

10pF

 

 

 

 

4pF

 

Span 500 M-e c?

IFEW 70 kHe

img26

 

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUITECHNOLOYCO.,LTD.

Prepared by:JIEXI        Designed by:Jason          Checked by:Jason      Approved by:MR.FANG

TITLE:3.2x1.6x 0.5(mm)WiFi/Bluetooth Ceramic Chip Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV

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PAGE  9      OF    13

 

 

 

 

 

 

 

10.Soldering Conditions

a.Typical Soldering Profile for Lead-free Process

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

11.Packing

Temperature(c)

 

 

img272en²                                20-40

 

 

150-200°

 

 

 

 

 

 

 

 

Pre-heati

60-150s

60-180s

Time

(1)Quantity/Reel:6000 pcs/Reel

img28

 

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUITECHNOLOYCO.,LTD.

Prepared by:JIEXI        Designed by:Jason         Checked by:Jason         Approved by:MR.FANG

TITLE:3.2x1.6x 0.5(mm)WiFi/Bluetooth Ceramic Chip Antenna (YF3216H2)Engineering Specification

DOCUMENT NO

FH3216Q23P52

REV

B

PAGE  10 OF    13

 

 

img29

 

 

 

img30Reel   Specification

 

Reel and Taping Specification

 

img31

 

 

TYPE

SIZE

A

φB

φC

φD

W

φM

 

3216

7”

5K/Reel

2.0±0.5

13.5±1.0

21±1.0

60±1.0

11.5±2.0

178±2.0

 

Tapping   Specification

 

 

 

 

 

 

T

 

 

 

Packaging

Type

A

B

W

E

F

G

H

T

φD

P

Paper Type

3216

1.90±0.20

3.50±0.20

8.0±0.20

1.75±0.10

3.5±0.05

4.0±0.10

2.0±0.05

0.75±0.10

+0.10

1.50

-0

4.0±0.1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

img32

Prepared by:JIEXI

 

 

深圳市福汇科技有限公司

SHENZHEN FUHUI TECHNOLOYCO.,LTD.

Designed by:Jason Checked by:Jason     Approved by: MR.FANG

 

 

 

TITLE:

 

3.2×1.6x 0.5(mm)WiFVBluetooth Ceramic Chip Antenna (YF3216H2)Engineering Specification

 

DOCUMENT

NO.

 

FH3216Q23P52

PAGE   11

 

 

 

OF

 

REV.

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13

 

 

 

Boare

Flex

(SMD)

1.Mounting method:

IR-Reflow.PCB Size (L:100×W:40×T:1.6mm)

2.Apply the load in direction of the arrow until bending reaches

2 mm.

 

No Visible Damage

AEC-Q200

005

Adhesion

Force of 1.8Kg for 60 seconds.

 

No Visible Damage

Magnification of 20Xor

greater may be employed for inspection of the

mechanical integrity of the device body terminals and body/terminal junction.

AEC-Q200

006

Physical

Dimension

Any applicable method using x10 magnification,micrometers, calipers,gauges,contour projectors,or other measuring

equipment,capable of determining the actual specimen

dimensions

In accordance with

specification.

JESD22

JB100

 

img33

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUI   TECHNOLOYCO.,LTD.

Prepared by:JIEXI                Designed by:Jason Checked by:Jason Approved by:  MR.FANG

TITLE: 3.2×1.6x0.5(mm)WiFi/Bluetooth Ceramic    Chip

Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV.

B

PAGE    12      OF       13

 

 

 

 

 

 

 

Reliability Table

 

Test Item

Procedure

Requirements

Ceramic Type

Remark

(Reference)

Electrical

Characterization

 

Fulfll the electrical specification

User Spec

Thermal

Shock

1.Preconditioning

50±10℃11hr,then keep for24±1 hrs at room temp. 2.Initial measure:Spec:refer Initial spec.

3.Rapid change of temperature test

-30℃ to +85℃;100 cycles

15 minutes at Lower category temperature

15 minutes at Upper category temperature

No Visible Damage

Fulfill the electrical specification

MIL-STD-202

107

Temperature

Cycling

1.Initial measure:Spec:refer Initial spec

2.100 Cycles(-30℃ to+85℃),Soak Mode=1 (2 Cycle/hours) 3.Measurement at24±2Hours after test condition.

No Visible Damage

Fulfill the electrical specification

JESD22

JA104

High Temperature

Exposure

1.Initial measure:Spec:refer Initial spec.

2.Unpowered;500hours @T=+85℃

3.Measurement at24±2 hours after test

No Visible Damage

Fulfill the electrical specification

MU STD-202

108

Low Temperature

Storage

1.Initial measure:Spec:refer Initial spec

2.Unpowered:500hours @T=-30℃

3.Measurement at24±2 hours after test

No Visible Damage

Fulfill the electrical specification

MIL-STD-202

108

Solderability

(SMD Bottom Side

Dipping method

a.Temperature:235±5°℃

b.Dipping time:3±0.5s

The solder should cover over 95%of the critical area of bottom side

IEC 60384-21/22 4.10

Soldering Hea

Resistance

(RSH)

Preheating temperature:150±10°C.

Preheating time:1~2 min.

Solder temperature:260±5°C.

Dipping time:5±0.5s

No Visible Damage.

IEC 60384-21/22 4.10

 

img34

 

深圳市福汇科技有限公司

SHEN ZHEN FUHUI TECHNOLOYCO.,LTD.

Prepared by:JIEXI                Designed by:Jason Checked by:Jason Approved by:  MR.FANG

TITLE: 3.2×1.6x0.5(mm)WiFi/Bluetooth Ceramic    Chip

Antenna (YF3216H2)Engineering Specification

DOCUMENT

NO.

FH3216Q23P52

REV.

B

PAGE    13      OF       13

 

                                                       部分陶瓷天线实物图

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